AGX ORIN Dev kit Fan Heatsink and SOM separation- possible?

Looking at the STEP file for the Orin Development board and taking off the cover it appears that the heatsink may be adhered to the SOM. I did not try to force the heatsink from the SOM but I was wondering if anyone knows if the bond can be broken and the SOM exposed? We are hoping to be able to build a prototype enclosure with external heatsinking.

Any insight would be helpful.



Hi, Dev kit is for development only not for product. We have no suggestion on this kind of use case.

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