AGX ORIN Dev kit Fan Heatsink and SOM separation- possible?

Looking at the STEP file for the Orin Development board and taking off the cover it appears that the heatsink may be adhered to the SOM. I did not try to force the heatsink from the SOM but I was wondering if anyone knows if the bond can be broken and the SOM exposed? We are hoping to be able to build a prototype enclosure with external heatsinking.

Any insight would be helpful.

Thanks,

Don

Hi, Dev kit is for development only not for product. We have no suggestion on this kind of use case.

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