AGX Thermal Plate modification

Is it OK to mill out a 1mm deep recess in an AGX Xavier Module bottom thermal plate to accommodate a daughtercard component that sits on a host board and is just too tall to fit in the space between the bottom plate and host board? The plan would be to remove the bottom plate, mill it, and re-attach. The recess is about 1sq-Inch in area, and 1mm deep.

Hi, we don’t have suggestion on this modification. Hope someone has such experience can be shared, or you can try it as wish.

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