Boot process failing very early - MB1

We are designing a custom carrier board for the AGX Xavier, and the boot process fails very early with this error:

[0000.205] I> Boot-device: eMMC
[0000.208] I> Boot-device: eMMC
[0000.217] I> Sdmmc: HS400 mode enabled
[0000.222] I> ECC region[0]: Start:0x0, End:0x0
[0000.226] I> ECC region[1]: Start:0x0, End:0x0
[0000.230] I> ECC region[2]: Start:0x0, End:0x0
[0000.234] I> ECC region[3]: Start:0x0, End:0x0
[0000.238] I> ECC region[4]: Start:0x0, End:0x0
[0000.242] I> Non-ECC region[0]: Start:0x80000000, End:0x100000000
[0000.248] I> Non-ECC region[1]: Start:0x0, End:0x0
[0000.252] I> Non-ECC region[2]: Start:0x0, End:0x0
[0000.257] I> Non-ECC region[3]: Start:0x0, End:0x0
[0000.261] I> Non-ECC region[4]: Start:0x0, End:0x0
[0000.267] E> FAILED: Thermal config
[0000.274] E> FAILED: MEMIO rail config
[0000.287] I> Boot-device: eMMC
[0000.297] I> sdmmc bdev is already initialized
[0001.839] E> WP-1 ACK pending
[0001.842] E> Error: 0
[0001.844] E> Task 71 failed (err: 0x32320006)
[0001.848] E> Top caller module: CPUINIT, error module: CPUINIT, reason: 0x06, aux_info: 0x00
[0001.856] I> MB1( BIT boot status dump :
[0001.886] I> Reset to recovery mode

The module works fine on the dev board, and as far as we can tell all voltages are nominal. Is there something missing in our power sequencing?

Thank you.

Hi, did you probe the power on sequence based on that in OEM DG? Please compare your design to dev kit especially on the parts of power and strapping. Additionally there is a checklist sheet in OEM DG which should be used to check custom design.

The problem here for anyone wondering is that NVDBG_SEL and NVJTAG_SEL switches on our board were in the wrong position.