Designing embedded vision systems involves complex camera interfaces like MIPI, LVDS, and SLVS-EC, leading to tight mechanical constraints, increased CPU load, and integration challenges. Additionally, the lack of an onboard Image Signal Processor (ISP) in many cameras adds further processing overhead on the host system.
NVIDIA’s Holoscan framework addresses this issue with its Ethernet-based sensor aggregation. However, most currently available HSB solutions are either too large or lack an onboard ISP.
e-con Systems offers compact Holoscan camera solutions built on NVIDIA’s Holoscan framework and in-built ISP. These solutions enable seamless connectivity of multiple cameras and sensors over Ethernet, simplifying design without worrying about camera interfaces. They also feature e-con Systems’ proprietary onboard TintE ISP® for reducing CPU usage and optimizing image quality, making them ideal for ADAS, robotics, and drones.
In this blog, we’ll explore e-con Systems’ Holoscan camera solutions in detail, highlighting what makes them unique and how they enhance AI-driven applications through integration with the NVIDIA® Holoscan SDK on NVIDIA Jetson platforms.
What is the Impact of e-con Systems’ Holoscan Camera Solutions with TintE ISP?
e-con Systems’ Holoscan camera solutions feature ACC_FPGA_MI_WTB_ADP, a compact 10G Ethernet adaptor board designed to interface with cameras using the MIPI CSI-2 interface for high-performance embedded vision applications. The compact HSB camera solution with enclosure is shown in the image below.
Figure 1: Compact HSB Camera Solution with Enclosure
This adaptor board features two micro-coaxial connectors, supporting x2 or x4 lane MIPI CSI-2 DPHY camera modules, allowing simultaneous connection of multiple cameras. The dimension of e-con Systems’ HSB evaluation board is 55 mm x 50 mm x 1.6 mm.
The board output brings the 10G interface through an RJ45 instead of an SFP connector, which greatly reduces the overall board size.
Check out the image below to understand e-con Systems’ HSB evaluation board.
Figure 2: HSB Evaluation Board (ACC_FPGA_MI_WTB_ADP)
e-con Systems’ HSB evaluation board has an option for connecting two cameras. Currently, e-con Systems supports one camera, and support for the two cameras will be extended soon.
e-con Systems’ HSB evaluation board with the camera is shown below.
Figure 3: HSB Evaluation Board with camera
The adaptor board utilizes a Lattice® FPGA technology running e-con Systems’ proprietary TintE ISP, which offloads intensive image processing tasks from the GPU. As a result, the computational load on the system is greatly decreased, improving performance for AI-driven applications.
See the image below to understand how our HSB camera solutions work.
Figure 4: HSB Camera Solutions – conceptual diagram
Designed for seamless compatibility with NVIDIA AGX Orin™ and NVIDIA IGX Orin™ platforms, the adaptor supports integration via the NVIDIA Holoscan SDK, enabling advanced sensor processing and edge AI capabilities. The board also includes a USB Type-C power input for simplified deployment, and an IO Interface connector to support the Sensor Fusion with LiDAR and RADAR.