Hello, I am working on a thermal and packaging design using the Orin NX SOM. I am required to use a passive solution for thermal management. The Orin NX will plug into a large carier/motherboard using a right angle SO-DIMM connector. I would like to mount a copper heat spreader to the top of the SOM where it would interface with the SoC. The motherboard with the SOM and heat spreader attached would be flipped over and lowered onto a heat sink, where the copper heat spreader would interface with the heat sink via a thermal pad. Does anyone know how much loading I can apply to the SOM? There are standoffs that secure the SOM to the carrier/motherbaord but at the other end of the SOM it is just plugged into the SO-DIMM connector. I’m concerned about how much force can be applied and the potential damage it could cause to the SO-DIMM connector or the SOM of course. I’m also concerned about flatness as the SOM is only anchored at the 2 mounting points. How secure is the end at the SO-DIMM connector? Does the SOM float inside that connector? Has anyone else worked on a direct sink option? Any help would be greatly appreciated. Thank you.
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