GTC 2020 S21631
Presenters: Jimin Wen,ANSYS INC; Akhilesh Kumar,Ansys
Get to know ANSYS’ strategy for the AI-based thermal solution of the modern chip-package-system design, as well as the data-driven DNN-based fast chip thermal solver we’re going to announce. IC/package/system designers in the traditional semiconductor industry or 5G, automotive, and AI application will benefit the most from our session.
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