How could I best move the heat sync from above the board, to beside the board?

I am working on something that has plenty of horizontal space, but limited vertical space. Would a single copper plate (100x100x3 mm) with a heat pipe in the center over the main soc leading to a laptop fan assembly work? Or do I need to remove heat from more specific areas on the board?

For thermal design, please refer the thermal design guide in DLC. No other suggestion on what you mentioned, the only target of thermal design is to keep the temperature of chips are in range as you know. So you can consider the detail solution based on that.

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