We are currently using the NVIDIA Jetson AGX Xavier in an embedded system for a long-life application.
From available documentation, we understand that the module is typically specified with an operating lifetime on the order of ~5 years under defined conditions. However, our system-level requirements extend significantly beyond this timeframe.
We would like to better understand the long-term reliability characteristics of the Xavier platform:
Does the ~5-year lifetime represent a validated operating window, or a strict wear-out limit?
What are the primary expected failure mechanisms over time (e.g., thermal cycling, electromigration, memory wear, etc.)?
Beyond the rated lifetime, is the expected behavior characterized by:
It means after 5 years, the product will exit useful lifetime/random failure phase and enter wear-out phase. The failure rate will increase, but it does not necessarily mean the unit must be replaced strictly after 5 years, if your application is not mission critical (automotive or eVTOL) or if you have redundancy in system design.
These failure mechanisms may be expected over time: solder ball cracks due to thermal mismatch from daily temp swing and ON/OFF temp swing, solder crack under big components like 2R2 inductors from shock due to heavy set-down or repeated high-G vibration.