I am currently in the process of designing a new product that incorporates the Jetson NX Orin 16GB module. For thermal management, we are using Fujipoly PG80A thermal pads on the main die and other components that require heat dissipation . According to the thermal management specifications (Jetson Orin NX Series Thermal Design Guide), we need to ensure that the pressure on the die does not exceed 60 PSI and that there is no more than 500 micro-strain within 5 mm (see Fig. 1).
Could you please explain the requirement regarding the 500 micro-strain within 5 mm? How can we design a heat exchanger to meet this specification while managing the pressure applied by the thermal pads on the hot components?
Best regards,
Fig1: