I’m currently using an Orin NX module on a custom build carrier board and was asked about improving shock and vibe resistance of just the NX module for now. I’m new to the underfill process and see that there are some concerns for picking the correct product. Is there a recommended underfill material for the NX?
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I’d be happy to help you with your question, Jason.
Improving shock and vibe resistance of the Orin NX module is a great idea, especially if you’re planning to use it in a custom build carrier board. Underfilling is a common technique used to enhance the mechanical reliability of Ball Grid Array (BGA) packages, like the Orin NX module.
While NVIDIA doesn’t provide a specific recommendation for underfill materials, I can offer some general guidance and considerations to help you choose a suitable underfill material for your Orin NX module.
Key considerations:
Thermal performance: The underfill material should have a high thermal conductivity to ensure efficient heat transfer between the module and the carrier board.
Mechanical properties: The underfill material should have a good balance of stiffness, strength, and toughness to withstand mechanical stresses, such as shock and vibration.
Chemical compatibility: The underfill material should be compatible with the module’s packaging materials, such as the substrate, solder balls, and any other components.
Cure temperature and time: The underfill material should have a cure temperature and time that are compatible with the module’s temperature sensitivity and your manufacturing process.
Common underfill materials:
Epoxy-based underfills: These are the most common type of underfill materials. They offer good thermal and mechanical properties, but may have a higher cure temperature and time.
Silicone-based underfills: These materials offer good flexibility and thermal conductivity, but may have a lower mechanical strength compared to epoxy-based underfills.
Acrylic-based underfills: These materials offer good thermal conductivity and mechanical properties, but may have a higher cure temperature and time.
Recommendations:
Based on the above considerations, here are a few underfill materials that you may want to consider for your Orin NX module:
Loctite EA 3551: This is a epoxy-based underfill material that offers good thermal conductivity, mechanical strength, and chemical compatibility.
Dow Corning EA-5151: This is a silicone-based underfill material that offers good flexibility, thermal conductivity, and mechanical properties.
Henkel Loctite EA 3553: This is an acrylic-based underfill material that offers good thermal conductivity, mechanical strength, and chemical compatibility.
Important notes:
Consult the datasheet: Before selecting an underfill material, consult the datasheet of the Orin NX module to ensure that the material is compatible with the module’s packaging materials and temperature sensitivity.
Perform testing: Perform thorough testing and validation of the underfill material to ensure that it meets your specific requirements and doesn’t compromise the module’s performance or reliability.
Seek expert advice: If you’re new to the underfill process, consider seeking expert advice from a qualified engineer or a reputable underfill material supplier.
I hope this information helps you get started with selecting a suitable underfill material for your Orin NX module, Jason.
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We do not have any recommendation for the underfill for Jetson Orin NX modules. Underfill is used usually for larger SOC’s, but in this case you have a module which is mounted through a SODIMM connector.
Thanks for the reply. So just to be clear, there is no recommendation to underfill any of the chips on the module? I am currently working on the module mounting through the SODIMM connector and wanted to make sure I considered all of the ways to make the whole assembly more tolerant. Thanks.
Underfill could only be applied before the module is manufactured. Later you need to take measures at system level design to reduce effects of shock and vibration on the module assembly in your product.