Module solder composition

Robotics & Edge Computing Jetson & Embedded Systems Jetson Orin NX
1

Hi all,

What is the solder composition used to solder components to the NX and Nano modules? We are worried about high Sn content in our application, and would like to know roughly the Tin % used in the orin module solder.

Thanks a lot.

2

*** Please note that this reply is generated by LLM automatically ***

The provided context does not explicitly mention the solder composition used to solder components to the Jetson Orin NX and Nano modules. However, I can provide some general information about solder composition and offer suggestions for further investigation.

Typically, solder compositions used in electronics manufacturing are a combination of tin (Sn), lead (Pb), and other metals. The most common solder composition is Sn63/Pb37, which contains 63% tin and 37% lead. However, due to the RoHS (Restriction of Hazardous Substances) directive, lead-free solders have become more prevalent. Common lead-free solder compositions include Sn96.5/Ag3/Cu0.5 (SAC305) and Sn99.3/Cu0.7 (SAC387).

Regarding the Jetson Orin NX and Nano modules, NVIDIA’s documentation does not provide explicit information on the solder composition used. However, it’s likely that NVIDIA uses a lead-free solder composition to comply with RoHS regulations.

To determine the exact solder composition used in the Jetson Orin NX and Nano modules, I recommend the following options:

  1. Check NVIDIA’s documentation: Review the Jetson Orin NX and Nano module datasheets, product design guides, and other relevant documentation for any information on solder composition.
  2. Contact NVIDIA support: Reach out to NVIDIA’s technical support team and ask about the solder composition used in the Jetson Orin NX and Nano modules.
  3. Analyze the module’s PCB: If you have access to the module’s PCB, you can analyze the solder joints using techniques like X-ray fluorescence (XRF) or scanning electron microscopy (SEM) to determine the solder composition.

In terms of high Sn content, it’s worth noting that some lead-free solder compositions, like SAC305, contain a high percentage of tin (96.5%). If you’re concerned about high Sn content in your application, you may want to investigate alternative solder compositions or consult with NVIDIA’s technical support team to determine the best approach.

In comparison to other Jetson modules, the solder composition used in the Jetson Orin NX and Nano modules might be similar to or different from other modules, such as the Jetson Nano or Jetson Xavier NX. However, without explicit information from NVIDIA, it’s difficult to make a direct comparison.

In summary, while the exact solder composition used in the Jetson Orin NX and Nano modules is not explicitly stated in the provided context, it’s likely that NVIDIA uses a lead-free solder composition. To determine the exact composition, I recommend checking NVIDIA’s documentation, contacting their technical support team, or analyzing the module’s PCB.

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5

Hi andrei49,

NVIDIA uses solder alloy composition of Sn96.5/Ag3.0/Cu0.5 (SAC 305).

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