Package questions

Regarding AGX Industrial Module

  1. Is the cover held to a better tolerance? Current +- 0.20 mm violates the connector mating requirements from Molex.

  2. Can there be direct mounting to the board instead mating to the cover?

  3. Why is the operational vibration level higher than the non-operational level. Is there a reason the vibration level is limited to 5Gs on the industrial part. (i.e. tested at higher levels and saw failures)

  4. What is the resonant frequency of the circuit card.

  5. What limits the operational lifetime to 10 years? Is this based upon the expected power on time or are there materials inside the GPU that degrade with time (i.e. clock, type of memory devices, tin whiskers, thermal grease drying out). If the module is not used much would this extend the life of the GPU beyond 10 years.

  6. Are there dissimilar metals used in the design. If so what are they and where are they used?

  7. Is the circuit board grounded to the metal covers of the GPU?

Please see below comments:

  1. The requirements of Molex is for reference, the real tolerance depends on the real board. +/-0.20mm is the tested better tolerance for Orin module pad soldering status.
  2. What do you mean direct mounting? The custom carrier should have a 699-pin connector to mate to Orin module.
  3. Will check and update once available.
  4. No such spec.
  5. Will check and update if possible.
  6. No such metal.
  7. The TTP is anodized, so if you are measuring for connectivity by touching GND and the TTP, they may not be getting to the conductive metal because of the anodization. The bottom part of the TTP (and top of the bottom plate) that sits on the PCB is machined so there should be no anodization, so that the TTP is GNDed to the PCB.

I believe the mounting holes in the AGX module allow you to attach the module to the PCB or the heatsink and module to the PCB.

Is this correct?

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