Placing components below the module.

My PCB is 96mm x 87mm, so I need any space I can get. This means that the components will be placed on the top and bottom.

Are there any restrictions for placing components below the TX1 module other than temperature and height? Such as EMI… On the carrier board some components are places blow the module.

Hi Rody,

I didn’t see any restrictions in the design guide and if you unmount the module from the Jetson you can see some passive components under it.
I think you can’t put critical devices near the power path on the top of the connector but components related to slow GPIOs/protocols (like I²C-UART-SPI) should be okay far enough from power and SerDes locations.