On the Orin NX/Nano “Thermal Design Guide” document, Figure 4-5 “Recommended TIM Placement” seems to be identical to Figure 4-1, only displaying the heat-sink envelope on top of the board. What is the recommended TIM placement?
Please refer to Jetson Orin NX Series and Jetson Orin Nano Module 3D CAD STEP model for further details. TIM should be over the Orin SOC.
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