Seeking Thermal Clarification

Hi. I would like some clarification on the Jetson Orin NX 16GB thermal specifications.

I see in Table 2-1 of TDG-11127-001_v1.1 that the maximum Orin SoC operating temperature is 99°C. It appears though from Table 3-1 in that document that the limiting components for this device are actually the 2X LPDDR5 parts with maximum allowable case temperature of 85°C. Can you confirm the LPDDR5 parts are the thermally limiting component for this device?

Are there any alternative Jetson Orin NX parts available where the LPDDR5 maximum allowable case temperature is higher than 85°C?

Any information you can provide is greatly appreciated.
Thank you.

I don’t get what you mean. All components in the table have their own Tcase which means the custom thermal design should take care all of them. In general, SoC is the main source of heat that needs to be monitored well enough.

Understood, thank you!

For the LPDDR5 parts what is limiting its maximum allowable 85°C case temperature? Is it the overmold of the component? Or perhaps the 85°C corresponds to a maximum junction temperature of the LPDDR5? What is the maximum allowable junction temperature of the LPDDR5 part? Is the 85°C maximum allowable case temperature a tested limit or based on the part’s datasheet? Just trying to understand possible failure modes of the LPDDR5 if brought above 85°C.

Thanks for your help!

The Tcase limit is from datasheet.

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