Dear NVIDIA team，
We paired a Jetson AGX Orin 32GB module with a custom carrier board, adapted it to the JetPack 6.2, and installed JTOP. However, we noticed a “loc1” field in the temperature section of the interface (see the image below):
What does this field represent, and how did it come into being?
I also observed on the Orin development kit and found that this field is not present in it.
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The question is about the “loc1” field in the temperature section of the JTOP interface on a custom carrier board with a Jetson AGX Orin 32GB module. The user is wondering what this field represents and how it came into being, especially since it is not present on the Orin development kit.
Unfortunately, the provided context does not explicitly mention the “loc1” field. However, based on the available information, we can try to provide a possible explanation.
The Jetson AGX Orin Developer Kit consists of a P3701 System on Module (SOM) connected to a P3737 carrier board. The SOM and carrier board each have an EEPROM where the board ID is saved. The SOM can be used without any software configuration modifications.
The SOM that is sold to be incorporated with customer products has a Thermal Transfer Plate (TTP) that is ready to accept a customer-provided thermal solution. The module that is shipped as part of the Developer Kit does not have TTP, but it has a thermal solution that is designed for the Developer Kit.
The thermal solution of the customer’s system design should attach to the module directly. Mounting holes are provided on the PCB to enable attachment of the customer’s thermal solution.
The NVIDIA Orin SoC junction temperature (Tj) represents the Orin SoC die temperature read from any of the internal temperature sensors. T.SoC refers to the junction temperature.
Considering the above information, it is possible that the “loc1” field in the temperature section of the JTOP interface represents a temperature reading from a specific location on the custom carrier board. This location might be a thermal sensor or a temperature monitoring point that is not present on the Orin development kit.
Since the custom carrier board is adapted to the JetPack 62, it is possible that the “loc1” field is related to the thermal solution or the temperature monitoring system on the custom board. The fact that it is not present on the Orin development kit suggests that it might be a custom implementation or a feature specific to the custom carrier board.
To confirm the exact meaning of the “loc1” field, it is recommended to consult the documentation or contact the manufacturer of the custom carrier board or the JTOP interface.
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Hi xbc_1203,
Is the custom board designed by you?
Could you share the result of the following command on your board?
$ grep -r "loc1" /sys/class/thermal/*/type
Please also share the full device tree for further check.
This is the complete device tree after decompilation:
ritrontek.txt (333.1 KB)
loc1 may be added in your device tree for specific thermal zone and it should be read from the sysfs node.
Hi @KevinFFF ，
Thank you for your reply.
I have found the specific information about “loc1”, which represents the internal temperature of the i350 chip. The specific path is /sys/class/hwmon/hwmon6.
