Thermal/mechanical coupling between TTP and top cover

I would like to know how the heatpipes on the Jetson Xavier module are thermally and mechanically coupled to both the thermal transfer mid-plate and the thermal transfer plate (TTP) of the module.

Since there is a need to float the mid-plate in the Z direction, I’m assuming that the heat pipes are not rigidly attached to both sides. Is there a soft coupling to a particular side? If so, what material is used for that soft coupling?

From what I understand, the Jetson module actually presses the top metal against the top of the dies, and the heat sink then presses on top of the module (likely with some thermal paste.) I don’t think there are any heat pipes involved? Or is that picture actually from the Xavier documentation?

Additionally, the TX2 module had a thermal interface design document that even showed where the main heat sources were below the top of the module, so you knew where to focus your heat wicking; I imagine we will get the same kind of drawing for Xavier as soon as the documentation and devkit reaches “release” status.

The picture was taken from the Jetson Xavier CAD. Please note that the dev kit has a different implementation than the commercial module. Only the module has the heat pipes.

The question is in regards to the Jetson Xavier module with the heatpipes, not TX2.

Yes, the reason to mention the TX2 was to illustrate that NVIDIA in the past released a lot of thermal information, and I’m looking forward to seeing it released for the Xavier as well.

Hi ChristianW,

This kind of information inside module is not public, all user need to do is to follow the thermal DG to design thermal solution.