Thermal Resistance of stock TX1 Developer kit cooling solution


My team is using the TX1 Developer kit and we’d like to model the thermal performance of the stock cooling solution to determine if we need to implement a different solution. We’ve had issues with the TX1 shutting off and we suspect this is due in part to exceeding the maximum operating temperature. Is there any information on the thermal resistance of the thermal interface material/heatsink on the Developer kit?

Thank you.

Hi zabrock,

Please refer to below topics for detail info: