Hi,
We disassemble the AGX SOM from its thermal dissipation plate at our factory and reassemble it on our carrier board and mechanical covers.
Can you provide PCB washing/cleaning instructions?
Is aqueous wash, co-solvent, or IPA cleaning acceptable?
Are you disassembling a Jetson Orin DevKit to reuse the module on your carrier board? This usecase is not supported so no further information can be provided.
Or are you removing the Thermal Transfer Plate (TTP) from the industrial module? This is also not a supported usecase. Please refer to this bullet point in section 1.1 of the Jetson AGX Orin Series (including AGX Orin Industrial) Thermal Design Guide:
No, We are disassembling the Thermal plate from the Jetson AGX Orin module. Also on the same project. Regarding the power-down sequence, what is the risk for powering off the supplies to the module simultaneously without following the power-down described in the datasheet and design guide documents?
There is no update from you for a period, assuming this is not an issue anymore.
Hence, we are closing this topic. If need further support, please open a new one.
Thanks ~0204
As above, removing the Thermal Transfer Plate from the module is not supported.
Regarding the power-down sequence, what is the risk for powering off the supplies to the module simultaneously without following the power-down described in the datasheet and design guide documents?
Does the MODULE_POWER_ON signal input to the module go low prior to the supply rails turning off? If it does go low first, what is the timing to the rails starting to turn off?