The comparison and migration document shows the Tegra X2 as being a significantly different size between the two boards. (18x18mm vs 33x33mm) I’m assuming for a size that different that the chip is actually built on a different process node, but there may be some other reason. Can you shed some light on this for us, we have customers who worry about certain processes and their reliability.
That does not explain the large chip-size difference. We are very interested but need to understand some of the physics related issues based on the process node (ideally, factory and process) of the chip.
The X2 is 324mm^2
The X2 industrial is 1089mm^2
That is a huge difference, we’re just trying to understand (at least somewhat technically) the difference. We understand it was “made for harsh environments…”