Why did Nvidia decide to use a non-standard 6.57mm standoff height for the Orin NX? Yea, I’ve read all the forum posts about it and still have no idea why they did that. SMARC on the other hand uses SODIMM connectors that use even number value standoffs - 3mm, 5mm - stuff you can get from MFG’s like Wurth or PEM.
I’d like to here a good answer to this. I did find some 6.5mm ones.
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Unfortunately, the provided context does not explicitly state why NVIDIA decided to use a non-standard 6.57mm standoff height for the Orin NX. However, I can provide some insights and comparisons that might be helpful.
The Jetson Orin NX series, as well as other Jetson modules, are designed to be compact and versatile, allowing for a wide range of applications and use cases. The choice of standoff height might be influenced by various factors, such as:
In comparison, the SMARC (Smart Mobility ARChitecture) standard, which uses SODIMM connectors with even number value standoffs (e.g., 3mm, 5mm), is a different design approach. SMARC is a standardized form factor for computer-on-modules (COMs), which aims to provide a common interface and mechanical compatibility across different modules and carrier boards.
While the SMARC standard uses more conventional standoff heights, the Jetson Orin NX series might have specific design requirements that necessitate a non-standard standoff height. It’s possible that NVIDIA’s design team chose the 6.57mm standoff height to address specific technical challenges or to optimize the module’s performance, thermal management, or mechanical reliability.
In the absence of an explicit statement from NVIDIA, it’s difficult to provide a definitive answer. However, it’s worth noting that the use of non-standard standoff heights is not uncommon in the electronics industry, and manufacturers often make design choices based on specific technical requirements or constraints.
If you’re looking for a solution to work with the 6.57mm standoff height, you’ve already found some 6.5mm standoffs, which might be a suitable alternative. You may also want to consider consulting with NVIDIA’s technical support or a mechanical engineering expert to better understand the design considerations behind the Orin NX module’s standoff height.
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On top of that… TE shows the center of the card inserted into the 2309413-1 to be 7.3mm. So a 1.2mm card would be sitting at 6.7mm (7.3 - 0.6) when centered between the contacts. Now 6.5mm is about 8mil short and if you take into account the copper on the pad for the standoff you’re only off a few mil.
and the LLM - useless just like all AI. Just a parrot as explained on my page here: Why AI Will Never Really Exist and by scientists like Professor Emily Bender of UofW. Even the IEEE magazine Spectrum here:
https://connect.ieee.org/NzU2LUdQSC04OTkAAAF_25RXSkK5dpCWTwow7GQbk2fpbs6N3DtYaBiMqsYFKnCmQa1r8wSoHxF16fAOhe3kBiQL7Bg=
is titled, “Why Is AI So Dumb?” Read it.
I am checking on the reason for the 6.57mm standoff height.
Note that in section 5.2 of the Jetson Orin NX Series and Orin Nano Series Design Guide, the standoff height used on the Orin NX Dev Kit is not a hard requirement for custom carrier boards:
Other SODIMM connector heights are available. If a different height connector is used, the standoff height will have to be adjusted accordingly to account for the difference in height from main PCB to module PCB.
The Orin NX Dev Kit comes with the needed 6.57mm standoffs. Do you have a need to procure more of the ones specifically used on the Dev Kit?
Per the Mechanical Engineering team: the solder bumps on the mounting holes add height and 6.57mm standoffs were found to be the best compromise.
Yea - the 6.5 soldered in standoffs seem to sit at the right height…