�� [0011.362] W> RATCHET: MB1 binary ratchet value 4 is too large than ratchet level 2 from HW fuses. [0011.370] I> MB1 (prd-version: 1.5.1.9-t194-41334769-73a9b7ef) [0011.376] I> Boot-mode: RCM [0011.378] I> Chip revision : A02P [0011.381] I> Bootrom patch version : 15 (correctly patched) [0011.386] I> ATE fuse revision : 0x200 [0011.390] I> Ram repair fuse : 0x0 [0011.393] I> Ram Code : 0x0 [0011.396] I> rst_source : 0x0 [0011.398] I> rst_level : 0x0 [0011.402] I> USB configuration success [0013.393] I> bct_bootrom image downloaded [0013.401] W> MB1_PLATFORM_CONFIG: device prod data is empty in MB1 BCT. [0013.409] I> Temperature = 24000 [0013.412] W> Skipping boost for clk: BPMP_CPU_NIC [0013.416] W> Skipping boost for clk: BPMP_APB [0013.420] W> Skipping boost for clk: AXI_CBB [0013.424] W> Skipping boost for clk: AON_CPU_NIC [0013.428] W> Skipping boost for clk: CAN1 [0013.432] W> Skipping boost for clk: CAN2 [0013.436] I> Boot-device: QSPI [0013.439] I> Boot-device: QSPI [0013.442] I> Qspi flash params source = mb1bct [0013.446] I> bct_mb1 image downloaded [0013.456] I> ECC region[0]: Start:0x0, End:0x0 [0013.460] I> ECC region[1]: Start:0x0, End:0x0 [0013.464] I> ECC region[2]: Start:0x0, End:0x0 [0013.468] I> ECC region[3]: Start:0x0, End:0x0 [0013.472] I> ECC region[4]: Start:0x0, End:0x0 [0013.476] I> Non-ECC region[0]: Start:0x80000000, End:0x100000000 [0013.482] I> Non-ECC region[1]: Start:0x0, End:0x0 [0013.486] I> Non-ECC region[2]: Start:0x0, End:0x0 [0013.491] I> Non-ECC region[3]: Start:0x0, End:0x0 [0013.495] I> Non-ECC region[4]: Start:0x0, End:0x0 [0013.502] E> FAILED: Thermal config [0013.509] E> FAILED: MEMIO rail config [0013.519] E> Task 50 failed (err: 0x7979061c) [0013.523] E> Top caller module: ALIASCHECKER, error module: ALIASCHECKER, reason: 0x1c, aux_info: 0x06 [0013.532] I> MB1(1.5.1.9-t194-41334769-73a9b7ef) BIT boot status dump : 0000000000011111111110000111111111111110011000111110000000000000000000000000000000000000000000000000000000000000000000000000000011001000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000 [0013.562] I> Reset to recovery mode Same failure in SDK Manager with JP 4.6.1 Same failure in SDK Manager with JP 5.0.2 [0019.858] W> RATCHET: MB1 binary ratchet value 4 is larger than ratchet level 2 from HW fuses. [0019.866] I> MB1 (prd-version: 2.3.0.0-t194-41334769-0a17edc1) [0019.871] I> Boot-mode: RCM [0019.874] I> Platform: Silicon [0019.876] I> Chip revision : A02P [0019.880] I> Bootrom patch version : 15 (correctly patched) [0019.885] I> ATE fuse revision : 0x200 [0019.888] I> Ram repair fuse : 0x0 [0019.891] I> Ram Code : 0x0 [0019.894] I> rst_source: 0xb, rst_level: 0x1 [0019.899] I> USB configuration success [0021.893] I> bct_bootrom image downloaded [0021.902] W> PROD_CONFIG: device prod data is empty in MB1 BCT. [0021.907] I> Temperature = 36000 [0021.911] W> Skipping boost for clk: BPMP_CPU_NIC [0021.915] W> Skipping boost for clk: BPMP_APB [0021.919] W> Skipping boost for clk: AXI_CBB [0021.923] W> Skipping boost for clk: AON_CPU_NIC [0021.927] W> Skipping boost for clk: CAN1 [0021.931] W> Skipping boost for clk: CAN2 [0021.935] I> Boot-device: QSPI (instance: 0) [0021.939] I> Qspi flash params source = mb1bct [0021.943] I> bct_mb1 image downloaded [0021.953] I> Non-ECC region[0]: Start:0x80000000, End:0x100000000 [0021.961] W> Thermal config not found in BCT [0021.969] W> MEMIO rail config not found in BCT [0021.979] C> Task 0x4d failed (err: 0x8c8c011c) [0021.983] E> Top caller module: MB1_MSS, error module: MB1_MSS, reason: 0x1c, aux_info: 0x01 [0021.991] C> Error: 0x8c8c011c [0021.994] C> MB1(2.3.0.0-t194-41334769-0a17edc1) BIT boot status dump : 0000000000111111111001000000000001111011111100000011111111111111001110001111100000000000000000000000000000000000000000000000000010100000000001010000000000000101000000000010100000000000000000000000000000000000000000000000000000000000000000000000000000000000 [0022.024] I> Reset to recovery mode