SOC BGA pattern

What is the purpose of the pattern where the ball pitch widens along the diagonal within the red circle?
If the purpose is soldering reliability, we would like to the mechanism to improve the reliability.

And we found similar pattern in NVIDIA’s GPU.
Is this pattern used generally?

again, sorry, but you have a lot of similar questions, being VERY detailed in areas we consider as protection worthy IP, so will not answer these publically…
many thanks for your understanding