I am wondering if a failure in time versus temperature chart was deceloped during reliability analysis on the Jetson AGX Orin. I could use any of the temperatures that tegrastats provides such as the SOC or junction.
Currently there is no such tool for chart plot.
Maybe I could clarify my question. I am asking if NVIDIA did this sort of testing during development of the device. I am looking for information that will aid me in deciding if this device will be reliable for a certain amount of time in a certain type of thermal environment (or internal thermal reading).
Refer to Table 7.6 in the AGX Orin data sheet Log in | NVIDIA Developer
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Thanks @sgursal ! That is helpful. The MTBF and FIT are what I’m looking for, but there seems to be some missing context. Is there any information on what CPU/GPU loading percentage this test or simulation was ran at? Or possibly an internal temp (SOC, tdiode, etc) that was maintained for the test. I know we’re given 35C or 50C, but if that’s ambient temperature then the lifespan of the device must be related to the efficiency of the heat sink.
Test conditions and Reference Standard are also provided in Table 7.6. Thermal solution could affect lifetime of the product with lower Tj improving the FIT rates accordingly.
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