I need to ask some questions and discuss thermal considerations. I have read and understand Jetson-AGX-Orin-Series-Thermal-Design-Guide_TDG-10943-001_v1.3, but still have questions.
Thank you
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Based on the provided context, I’ll address your questions and discuss thermal considerations for the Jetson AGX Orin series.
The Jetson AGX Orin series, along with the Jetson Orin NX and Jetson Orin Nano series, share similar power management features, as mentioned in the provided text. However, the thermal design guide specific to the Jetson AGX Orin series (TDG-10943-001_v1.3) is not included in the provided context. I’ll rely on the information available for the Jetson Orin NX and Jetson Orin Nano series to provide general guidance and comparisons where applicable.
Thermal Considerations:
- Maximum Operating Temperature: The maximum operating temperature for the Orin SoC is 99°C (Table 2-1). It’s essential to design a thermal solution that maintains the SoC temperature below this limit to ensure optimal performance and reliability.
- Thermal Resistance Network: The thermal resistance network for the system thermal solution can be represented by an equation (Chapter 3, Section 3.1.1). This equation helps designers understand the thermal resistance between the SoC and the ambient environment.
- Component Placement: Figure 3-2 provides a map of the component placement on the Jetson Orin module PCB. This information is crucial for designing an effective thermal solution, as it helps identify areas of high thermal density.
- Thermal Solution Design: The Jetson Orin module is not equipped with a system-level thermal solution. It’s the customer’s responsibility to design an adequate thermal solution to maintain all component temperatures below the de-rated limits (Table 3-1).
Comparison with Jetson Orin NX and Jetson Orin Nano Series:
While the provided context doesn’t include specific thermal design guides for the Jetson AGX Orin series, we can infer some similarities with the Jetson Orin NX and Jetson Orin Nano series:
- All three series share similar power management features, which might imply similar thermal management requirements.
- The maximum operating temperature for the Orin SoC is the same across all three series (99°C).
- The thermal resistance network equation and component placement information might be similar or identical across the three series.
However, without the specific thermal design guide for the Jetson AGX Orin series, it’s challenging to provide detailed comparisons or specific recommendations.
Recommendations:
- Consult the Jetson AGX Orin series thermal design guide (TDG-10943-001_v1.3) for specific thermal considerations and recommendations.
- Ensure your thermal solution design maintains the SoC temperature below the maximum operating temperature (99°C).
- Use the thermal resistance network equation and component placement information to design an effective thermal solution.
- Verify that your thermal solution meets the de-rated limits specified in Table 3-1.
If you have specific questions or concerns not addressed in this response, please feel free to ask, and I’ll do my best to provide more detailed guidance.
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Apologies, the category didn’t easily allow a more exact choice and I forgot to mention that my client is using the Jetson AGX Orin Industrial. And the automated response covers everything in the document I referenced and have read. I still have questions and would like to speak to a person.
Thank you
Please list down you questions, then can know how to help.
On page 6 of the thermal guide, Table 2-2 indicates that the maximum TTP operating temperature is 85°C and also indicates that the recommended SoC operating temperature is 105°C and the maximum SoC operating temperature is 115°C. I presume that if the TTP is at 85°C, that the SoC will be at 105°C, but this is unclear.
On page13 of the thermal guide, Figure 3-4 shows the hole locations in the TTP (79.00 x 92.00mm). What is the tolerance on these dimensions? Also, what is the hole diameter and tolerance?
On page 15 of the thermal guide, point 5 of the assembly guidelines indicates that the M3 screws should be “fully torqued”. What is the recommended torque?
Thank you
If TTP temperature is 85C for AGX Orin Industrial module then the SOC will be within the recommended Orin SoC operating temperature and maintain the specified performance and reliability. Refer to Notes below Table 2-2 in the thermal design guide.
For tolerance and dimension please refer to the 3D CAD model Jetson AGX Orin Series Module 3D CAD STEP model (P3701) https://developer.nvidia.com/downloads/jetson-agx-orin-module-3d-step-modelzip
For M3 screws torque refer to Jetson AGX Orin Series Design Guide (including AGX Orin Industrial) Log in | NVIDIA Developer
Thanks for your reply. Regarding your answers, please see my replies below:
If TTP temperature is 85C for AGX Orin Industrial module then the SOC will be within the recommended Orin SoC operating temperature and maintain the specified performance and reliability. Refer to Notes below Table 2-2 in the thermal design guide.
I’ve read the notes and understand them, but this does not answer my question. If this is the only answer you can supply, I understand.
For tolerance and dimension please refer to the 3D CAD model Jetson AGX Orin Series Module 3D CAD STEP model (P3701) https://developer.nvidia.com/downloads/jetson-agx-orin-module-3d-step-modelzip
I have the 3D model and tolerance information is not available in the 3D model, therefore it needs to be communicated by some other means. Please provide the location tolerance of the holes and also the tolerance of the hole diameter.
Thank you
Please refer to the Mechanical Specifications in the AGX Orin data sheet. Jetson AGX Orin Series Data Sheet (Including AGX Orin Industrial) Log in | NVIDIA Developer
Thanks again for your reply – this drawing does have the hole diameter tolerance, but not the location tolerance.
Thank you!
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