We are planning to use the Jetson AGX Orin Industrial.
In order to properly set up the thermal analysis, we would like to receive additional information about the components of the JAOi:
- Main components power dissipation, including GPU SOC and DDRs.
- Recommended junction temperature limitations of the main components – especially components with high power density or low temperature limit (below 100 °C)
- Thermal model information – Thermal resistances values:
3.1. Junction to case of the main components, Theta_JC. Or alternatively – Junction to the top of the component’s case, Theta_JT.
3.2. Junction to board, Theta_JB