AGX Thermal Questions

Robotics & Edge Computing Jetson & Embedded Systems Jetson AGX Orin
1

Regarding AGX Industrial Module:

1 What options are there for sinking heat out beyond conducting to the cover? Fans are not permitted in our design. Can we remove the cover to sink heat out directly from the components?

  1. Are the GPU’s TTP internal heat pipes made out of copper?

  2. Are thermal gap pads used in the GPU and if so what is the thermal conductivity / material properties

  3. Junction thermal impedance seems high, what are the options to reduce this impedance?

  4. Is there a breakdown of all materials for the GPU?

6 Is there derating applied to the thermal design of the GPU?

Thanks

3

Hi, please refer to the Orin Thermal Design Guide and module datasheet in DLC. That’s all what we can provide.

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