The category is wrong, please bear with me. I am looking into the thermal design for the AGX Orin and I cannot tell if the module will come with the large heatsink or if it will come as a board with exposed components. Can you please confirm how the module is sold?
For our custom thermal solution, are we expected to remove the 16mm thick heat sink/enclosure that comes with the board?
Hello,
Thanks for visiting the NVIDIA Developer forums! Your topic will be best served in the Jetson category.
I will move this post over for visibility.
Cheers,
Tom
It is with TTP. For custom thermal design, please refer to the guide in DLC. TTP should not be removed.
Hi, thank you for replying. :)
I hear you saying that it is not advised for customers to create their own thermal solution and that the module will always come with the 16mm heat sink attached. Can you please tell me the orderable part number of the 64G version of the module, and also the orderable part number of the JAOi, industrial temp version?
Thank you.
No, custom thermal solution design is suggested. The module always come with TTP not heat sink. Please refer to FAQ site for part number.
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