Full load test issue

we have two pcs of Orin NX, found 1 pcs has quality issue,
We’ve tried:
a. swapping cooling fan
b. swapping carrier board
could you check and advise?
This is the full load status of normal Jetson Orin NX modules after 1 hour


And the following is the module with thermal issues, we observe the power dissipation is higher than normal one and seems hitting thermal throttle after 15 mins.

Hi,

Is it possible that change to 40W mode to do the test again?

We don’t expect MAXN mode to be run in any stress test.

Also, please put it to NV devkit and do the same test again.

Just want to clarify. I didn’t mean this issue does not exist. My point is just following the standard way to reproduce the issue first. Thanks for the help.

We’ve tried 40W testing before, it’s own operating temperature is lower, but it is still higher compared with other modules. can we apply a RMA for this Item?

For testing in NV devkit. To my understanding the official kit from nVidia supports 5V VDD_IN only and it needs rework on devkit to support VDD_IN higher than 5V. Please let me know if my understanding is incorrect.

The Dev Kit supports the high voltage needed for SUPER mode on Orin NX. On Orin NX, the MODULE_ID pin is open so the signal is high on the carrier board to select high voltage (HV) input to the module (19V from the included power supply). On Orin Nano, MODULE_ID is tied to ground to select 5V input to the module. For the Orin Nano case, there is a buck regulator (U3) to drop the 19V to 5V for the module. The schematics showing R231 stuffed/installed supersedes the written note you screen-captured.

Hi Chris:

Thanks. for the high temperature issue do you have any suggestion

Hi Rico,

I would like to know if you could reproduce on NV devkit first. May need your help to do this quick test.
Thanks

There is no update from you for a period, assuming this is not an issue anymore.
Hence, we are closing this topic. If need further support, please open a new one.
Thanks
~0408

Is this with the Orin Dev Kit’s cooling solution on both modules?

When you swapped cooling fans, did that include swapping the heatsinks and replacing new thermal interface material that is cured properly?