Hi,
We are working with a custom build for the Jetson AGX Orin Industrial module.
When we flash the board directly using the flash.sh command, the system boots successfully without any issues.
However, when we first generate the flash artifacts using the –no-flash option and later execute the generated **flashcmd.txt (**using sudo bash flashcmd.txt), the board fails to boot.
Upon investigation, we observed the following difference:
-
Direct flash (
flash.sh) uses:
bpmp_t234-TE992M-A1_prod_aligned.bin -
Generated flash command (
--no-flash) uses:
bpmp_t234-TE990M-A1_prod_aligned.bin
This BPMP firmware mismatch appears to be the cause of the boot failure.
During further debugging, we identified that the CHIP_SKU value influences the selected BPMP firmware. It seems that the SKU detected or configured during the --no-flash flow differs from the one used during direct flashing.
Could you please clarify what is the correct CHIP_SKU value for the Jetson AGX Orin Industrial module.
Here is our .conf file
source “${LDK_DIR}/p3701.conf.common”;
BOARDID=3701
BOARDSKU=0008
RAMCODE=4
echo "Sourced custom conf"
DTB_FILE="agx-orin-custom.dtb"
TBCDTB_FILE="$DTB_FILE"
BPFDTB_FILE="tegra234-bpmp-3701-0008-3737-0000.dtb";
BADPAGEFILE="bootloader/badpage.bin";
FSIFWFILE="bootloader/fsi-lk.bin";
PINMUX_CONFIG="Orin-custom-pinmux.dtsi"
PMC_CONFIG="Orin-custom-padvoltage-default.dtsi"
PMIC_CONFIG="tegra234-mb1-bct-pmic-p3701-0008.dts";
EMMC_CFG="flash_t234_qspi_sdmmc_industrial.xml";
MISC_CONFIG="tegra234-mb1-bct-misc-p3701-0008-flash.dts";
MISC_COLD_BOOT_CONFIG="tegra234-mb1-bct-misc-p3701-0008.dts";
MB2_BCT="tegra234-custom-mb2-bct-misc.dts";
OVERLAY_DTB_FILE="L4TConfiguration.dtbo,tegra234-custom-p3737-0000+p3701-0000-dynamic.dtbo,tegra234-carveouts.dtbo,tegra-optee.dtbo";
ODMDATA="gbe-uphy-config-0,hsstp-lane-map-3,nvhs-uphy-config-0,hsio-uphy-config-0";
Jetpack Version = 6.1
BSP Version = R36.4
Thank you.