We plan on attaching a heat spreader to the module, directly coupled to the TEGRA (U7) and DDR4 (M1, M2). Could you supply the following?
• CAD file of the module, STEP IGES etc. showing the package locations.
• Detailed mechanical drawing of the TEGRA and DDR4 packages. In particular, the mechanical height tolerances of each.
• We would like to use the existing NVIDIA leaf spring and screw (“PORG_LEAF_SPRING”); what is the recommended installed depth of the screw shoulder relative to the PCB surface? Should the shoulder be flush to the surface, or offset past the PCB, to obtain the correct pressure. Alternatively is there a spring constant for the leaf spring?
Hi, please check the Nano files in DLC first: [url]https://developer.nvidia.com/embedded/downloads[/url]