In the ORIN nano’s datasheet, I found a description of its operating life. Could you please explain the requirements for operating temperature and CPU load to achieve this lifespan? Can I achieve this lifespan even under the highest TTP and heaviest CPU load?
The operating lifetime is 5 years operation for 24 hours a day, 7 days a week at up to the maximum module power as listed for the specified Tj temperature range.
I have two questions:
-
Junction temperature is a concept specific to NV SOCs. Is controlling this temperature sufficient? If other components on the board (such as memory or power chips) overheat and malfunction, doesn’t that mean the NV module’s lifespan is affected? Why do I only need to focus on the SOC’s junction temperature and not other components?
-
Regarding SOC junction temperature, in actual testing, there are two scenarios: one is high ambient temperature and low CPU load, reaching a certain junction temperature (e.g., 105°C); the other is low ambient temperature and high CPU load, also reaching 105°C. These two scenarios have different impacts on module lifespan. Therefore, I would like to ask, in which scenario does the lifespan commitment in the datasheet apply?
Please refer to the Jetson Orin NX Series Thermal Design Guide.
You are correct that other components’ temperatures must be considered. In the Thermal DG you will find that the Orin SoC is required to be contacted by the cooling solution and monitored and the LPDDR5 DRAM must also be monitored but is not explicitly required to be contacted. The DG has tables with breakdowns of the power distribution across the components, where the SoC dominates the budget. Since DRAM is second, you may choose to contact it with your cooling solution as well, along with other components.
The lifespan covers both of the ambient temp vs CPU load scenarios you mentioned.
Also keep in mind that, as noted in section 5.3, the SoC temperature sensors have an accuracy of +/-3°C.
