Several Jetson Orin 64GB Devkit sudennly power-off unexpectedly used in our product body under 25℃

好的,我们把串口已经引出来了。正在复现中,还未复现。目前正常的完成测试,从满电到没电,测试出的串口log,我先发下您看看。等复现之后的串口log,我再更新
ReceivedTofile-COM3-2025_9_25_20-54-19.zip (15.1 KB)

請問你有辦法用ssh之類的多開一個console監控tegrastats的結果嗎? 反正機器關掉之後ssh就會停掉 tegrastats最後的結果一定會抓得到

有办法的,我们目前已经可以监控tegrastats的结果了。测试时同步监控tegrastats和串口log。刚才机器人静止充电时,在做一些log打包,发生了一次关机。这个tegrastats没有启动,但查看串口,关机前瞬间没有打印任何信息。请问,异常关机,一定会通过串口有信息吗?

我認為這個問題比較跟硬體 (電壓電流溫度) 相關, 所以serial log沒看到log也算是符合預期.

tegrastats在關機前最後的狀態可能比較會提供線索.

又复现了一次,产品在做完完整测试后,充电过程中,发生AGX突然断电
tegrastats_log截图如图


tegrastats原始log和串口log如附件,也没有看到异常值,串口log哪里体现出异常值了吗?tegrastats_log和串口log.zip (421.6 KB)。请协助分析关机的问题在哪里

Hi,

Want to confirm one point here. Your log shows timestamp around “1402” sec. Does it mean your issue just happen in around 20 min after you boot up and do the test?

[18:04:37.197]收←◆[ 1402.001236] cpufreq: cpu4,cur:1880000,set:1651200,delta:228800,set ndiv:129


想確認一下, 你的log裡面顯示最後有log的時間發生在timestamp 1402. 所以你開機之後跑20分鐘左右機器就自動關了嗎?

Please refer to the AGX Orin Thermal Design Guide for further guidance and thermal characterization of your thermal solution. And if you are exceeding the TDP of the AGX Orin module and it causes the TTP temperature to be above the limits or if the workload is not balanced which causes OC throttling, then you may need to fine tune your applications.

17点40开机,17点48分连接串口和记录tegrastates的,确实从17:40~6:04这24min 就出现了关断。syslog中记录了这个前后的信息
syslog.zip (142.3 KB)

Thanks for your reply. I‘ve read the thermal design guide. agx.dts.zip (37.4 KB)
From tegrastates info we recorded,temperature is below 90℃,not touch throtlling/shutdown trip point(99/10
3/104.5/105℃),Our thermal setting is the same as official file, we didn’t change.Do we need to. And power is around 40W, not exceed TDP. Why does the AGX oirn shutdown?

目前LOG里面都没有直接表明关机原因的信息,哪个LOG里可以看到直接和关机相关联的log呢?

which log can directly tell us the the shutdown reason?

目前LOG里面都没有直接表明关机原因的信息,哪个LOG里可以看到直接和关机相关联的log呢?

目前UART在關機前都沒有任何log, 所以這個現象比較像是硬體端觸發的.

Do you know maximum TTP temperature from your thermal characterization?