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Based on the provided context, I couldn’t find any specific information about the height specification for the NX/Nano SOM. However, I can provide some general guidance and suggestions to help you with your design issue.
According to the Jetson Orin NX Series and Jetson Orin Nano Series Modules Thermal Design Guide (TDG-11127-001_v1.5), the module installation and removal process is described in Chapter 5.3, which includes the following steps:
Assemble any required thermal solution on the module.
Install the module:
Start with a baseboard that has suitable standoffs to match the SODIMM connector height.
Insert the module fully at an angle of 25-35 degrees into the SODIMM connector.
Arc down the module board until the SODIMM connector latch engages.
Secure the module to the baseboard with screws into the standoff or spacer.
It’s possible that the height difference between the specifications and the actual NX/Nano SOM is causing the issue. I recommend checking the following:
Verify the SODIMM connector height on your baseboard to ensure it matches the specifications.
Check the standoff or spacer height to ensure it’s correct and suitable for the module.
Confirm that the module is installed correctly, following the steps outlined in the guide.
Review the thermal solution design to ensure it’s compatible with the module and baseboard.
If you’re still experiencing issues, I suggest consulting the official NVIDIA documentation or contacting their support team for further assistance. They may be able to provide more detailed information or guidance specific to your design.
In the provided context, there are some discussions and questions related to thermal design and module installation, but none of them specifically address the height specification for the NX/Nano SOM. If you have any more information or context about your design, I’d be happy to try and help you further.
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This is 3D envelope model and gives maximum component height areas. Some component height could be different due to multi sourcing and future updates. If thermal solution needs to touch other components then a thermal gap filler pad as appropriate could be used where necessary.