Sorry, this ticketing system does not have a category for my inquiry.
Hello, I am currently working on integrating the Orin NX SOM into our assembly. The requirements of our design does not allow for forced cooling. As it stands right now, the Orin SOM plugs into a SO-DIMM on our main board. It is a right angle connector where the Orin is parallel to our main board. The challenge of our thermal design is that we have to get heat routed to somewhere else without forced cooling. Our main board is part of an assembly that is in an enclosure. We are exploring heat pipes that would attach to the Orin and route the heat somewhere else where is could then be directed out of the enclosure. I was wondering if there are any tips or recommendations for direct sinking or for bolt on attachments such as a heat pipe plate assembly. Based on your thermal design pdf, it may not be recommended. I need someone who can provide some guidance on thermal solutions that are either direct sinking or using a heat pipe plate assy.
Thank you.
Hello,
Thanks for visiting the NVIDIA Developer forums! Your topic will be best served in the Jetson category.
I will move this post over for visibility.
Cheers,
Tom
Sorry I did not see that category. Thank you for moving it over.
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Hi, we don’t have other recommendation than that in the TDG.
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