Hi there,
I am currently upgrading a system that use the Xavier NX modules to the new Orin NX platform and seams like there is some minor differences that need to be minded for the new heat sink design.
Could you please confirm the following differences?
Hi @Trumany ,thanks for your reply. Yes that I saw already and thats why I am writing here.
Is this heights increase intentional ? Because this means that Heatsinks used in the Xavier NX products cannot be used with Orin NX.
Thanks
Yes, as said in TDG: It provides a 3D CAD model that shows an envelope that the board components will not exceed. Any heat sink should be designed to not intrude into the envelope.