I need to do a thermal simulation and I haven’t found a CAD model that allows this.
I need to model the hot spots and calibrate my thermal solution before I cut metal.
Has anyone found or made this?
According to the thread below, Nvidia doesn’t provide this.
As said in that topic: NVIDIA provides a 3D CAD file (STP format) of the Jetson Orin NX module on the downloads section of the “NVIDIA Developers Website.” It provides a 3D CAD model that shows an envelope that the board components will not exceed. Any heat sink should be designed to not intrude into the envelope. The heat sink should be referenced to the SoC die area (Highlighted).
For thermal simulation, please refer to the TDG doc in DLC.
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