Request for Fully Detailed 3D CAD Model of Jetson TX2 NX for Thermal Design Purposes


We are currently utilizing the Jetson TX2 NX (PN 900-13636-0010-000) in our project. However, the 3D CAD model we currently possess does not provide the level of detail required to design a suitable heatsink adapter for the specific components we aim to cool.

In accordance with your recommendations outlined in the thermal design guide, I am reaching out to kindly request a fully detailed 3D CAD model of the Jetson product we are utilizing. This model would greatly assist us in accurately designing our thermal interface material (TIM) and ensuring effective cooling for the critical components.

To illustrate the disparity between the existing non-detailed 3D CAD model we possess and the level of detail we are seeking, I have attached a photo for reference.

We would sincerely appreciate your support in providing a 3D CAD model that includes the relevant components required for our thermal design.

Thank you in advance for your attention to this matter.

Hi, as said in TDG: It provides a 3D CAD model that shows an envelope that the board components will not exceed. Any heat sink should be designed to not intrude into the envelope. The heat sink should be referenced to the SoC die area (Highlighted).

We do not provide detailed 3D models to customers - only the envelope model and the 2D mechanical dimensions in the Data Sheet. Customer should reference the Thermal DG for recommendations on thermal solutions. The 3D model and Data Sheet dimensions provide accurate height and location of the SoC and the height of the tallest DRAM we may use over time. Customer should use more flexible TIM for the DRAM.

In addition, please note the warning in TDG: If devices other than the SoC contact the heat sink (through TIM material), they must still be instrumented to ensure that the case temperature is not higher due to heat from the heat sink due to SoC heat being transferred to the other device. And Tcase of other components than SoC and DRAM is generally in range of 115C ~ 155C, which means most of them should not be contacted to heat sink.

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