Thermal paste advice

Hi, I cannot find anywhere technical advice/recommendation as of which grade of thermal paste is enough to dissipate the heat of the Jetson Nano production module.
In our design we would be mounting the production module against a aluminum heat dissipation pad that makes contact with the stainless steel case housing the PCB. We have foreseen to mount a heatsink outside the case, on top of the location of the Jetson Nano in case further heat dissipation is needed.

Thank you for your feedback

Best regards


Please refer to thermal design guide for detail. It provides the method to calculate the necessary thermal resistance which is the key point of thermal design option.

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