For AGX Xavier module with a 2.5mm height, the distance between module Bottom plate and Carrier Board PCB is 5+/-0.2mm, and the distance between module Bottom plate and Carrier Board PCB is 4+/-0.2mm. After subtraction calculation, the distance between module Bottom plate and Carrier Board PCB is only 1mm of no tolerance , which is very difficult for design consideration. Is there any tolerance range between module Bottom plate and Carrier Board PCB?
Thanks，look forward to your reply！
Hi
The washer tolerance depend on what the component you selected.
The Design Guide instance a standoff(washer) with ±0.13mm height tolerance for standoff height selection. 1.5mm would be suitable.
The gap between module bottom plate and carrier board PCB is 0.6 to 1.4(1±0.4mm)
The worst board to board spacing 1.03mm meet min to max sweep usage 1.06mm.
