About the JTop tool temperature sensor values

Temperature is monitored using the JTop tool.
I would like to know which element on the module the readings refer to.

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The Jetson Orin NX temperature readings monitored using the JTop tool refer to the temperature of the Orin SoC (System on Chip). This temperature is measured by multiple on-die temperature sensors that are placed close to dominant hotspots for real-time measurements of junction temperature.

According to the provided documentation, the Orin SoC has a maximum operating temperature of 99°C and a shutdown temperature of 105°C. These temperatures are critical to maintaining the performance and reliability of the Jetson Orin module.

In addition to the Orin SoC temperature, the Jetson Orin module also has other temperature sensors, such as the TMP451, which measures the temperature on the die near the GPU and the temperature of the board. However, these temperatures are not directly related to the Orin SoC temperature readings provided by the JTop tool.

Here’s a comparison of the different temperature sensors and their measurement locations:

  • Orin SoC temperature (measured by on-die temperature sensors): This is the temperature of the Orin SoC, which is critical to maintaining the performance and reliability of the Jetson Orin module.
  • TMP451 Remote sensor: This measures the temperature on the die near the GPU.
  • TMP451 Local sensor: This measures the temperature of the board.

It’s worth noting that the TMP451 thermal sensors are no longer included in the thermal zone sysfs nodes for optimization purposes, starting from release 36.4. However, temperature readings and configurations for TMP451 are still available via sysfs nodes provided by the hwmon framework.

In summary, the Jetson Orin NX temperature readings monitored using the JTop tool refer to the temperature of the Orin SoC, which is critical to maintaining the performance and reliability of the Jetson Orin module.

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All of the sensors you marked in the red box are on the die of the SoC (#1 in the diagrams).

The sensors’ locations on the die cannot be shared.