Thanks for your suggestions. Actually, we have one version of product with SOM inside from other 3rd party. It is circular in form factor & completely of plastic with all connector, etc IP66 rated.
As of now there no room for air flow, all convection happens through plastic body only so internal enclosure temperatures goes 20’C higher than ambient & processor junction temperatures (though passive heat sink attached) many times go above 90’C resulting into CPU speed throttling. We intend to rate product for 50’C ambient. We are looking into 5-7 years reliability of product so no fan or moving component kept in product.
I came across Jetson Nano & thought of using this product in rectangular form factor with some mechanism to attach processor case to metal enclosure chasis but then sun loading seems to be other issue for metal enclosures. We are looking with complete passive thermal dissipation.
FYI, product will contain 2X PoE+, 1 USB 3.0, 2X USB 2.0, etc. So lot of power dissipation is going to happen inside product & hence thought if NVIDIA could recommend anything better which has been working fine at field will be good for us.
Is there any recommendation suitable for our kind of product? Please advise.