PCB flex specification for Jetson Xavier NX

Hi,

I have two questions regarding the note in the Jetson Xavier NX Thermal Guide:

“For Jetson Xavier NX, the amount of flex (bow or bend) of the PCB should not cause more than 500 micro-strain within 5 mm of the Xavier SoC.”

  1. Could you please clarify the exact definition of this specification?

  2. Based on this definition, what is the allowable board deflection? Deformation/SoM length(69.6mm)=?%?

Thanks.

Please refer to IPC/JEDEC-9704 for strain gauge measurement setup https://www.jedec.org/sites/default/files/docs/IPC-JEDEC9704.pdf

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