Hi,
I have two questions regarding the note in the Jetson Xavier NX Thermal Guide:
“For Jetson Xavier NX, the amount of flex (bow or bend) of the PCB should not cause more than 500 micro-strain within 5 mm of the Xavier SoC.”
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Could you please clarify the exact definition of this specification?
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Based on this definition, what is the allowable board deflection? Deformation/SoM length(69.6mm)=?%?
Thanks.