We have an extremely weight-sensitive application for the TX2, and would like the option of integrating the thermal dissipative qualities provided by the TX2’s TTP (Thermal Transfer Plate) into the design of our enclosure, such that the TX2 module could be directly coupled to the (milled aluminum) enclosure.
The question of whether the TTP can be removed has been addressed in these forums before by another user of the TX1, with an Nvidia moderator concluding that it could not be done without voiding the warranty – which makes sense, given that the devices are extremely thermally-vulnerable. Typically, we would address this situation by designing our own board around the necessary Nvidia chipset, and developing a thermal dissipation solution from there – however, for those of us building devices of limited quantity, it’s nearly impossible to obtain the Nvidia chips that we would normally use to design our way out of the situation. So we find ourselves stuck between a rock and a hard place :)
Our engineers are capable of devising a solution that provides equivalent power dissipation, thermal resistance, and mechanical mating characteristics (downward force, spread, etc). Is there any way that Nvidia would work with us to “certify” our enclosure/heat-sinking implementation such that we could still retain a warranty for the module? If not, is there any way for us to procure a reference design and parts in small volumes, so that we could design our own solution?
Thanks in advance for your time and thoughts!