I’m working on the cooling system for the Nvidia Jetson AGX Orin 64GB. I would like to know if the heat pipes used inside the module are capillary-driven heat pipes or gravity-assisted heat pipes. From my understanding is should be capillary-driven.
I’m asking this question because in the Jetson AGX Orin Series-Thermal Design Guide_V1.3, the orientation of the Orin module or of the board is not mentioned. So my question is, can we place the electronic board and the Orin module attached to it up side down ? Is there any forbidden orientation of Orin ?
Hey, I have the same concerns. To place the module in different orientations, would that impact the heat pipe efficiency, the max. power the module can tolerate, and finally the max. computation power we could get?
Thermal solution needs to be tested/characterized based on your application environment to ensure it meets your needs. Refer to the Thermal Design Guide for further information. Log in | NVIDIA Developer
Heat pipes are capillary driven. AGX Orin module orientation like Vertical, Horizontal or at any angle in between not expected to affect performance as long as the thermal solution is deemed sufficient. We do not expect issues with AGX Orin module upside down orientation. However, we don’t have test data with that orientation.