I’m interested in the type of thermal interface material you are using inside the module that links the electronics with the thermal transfer plate. Can you share technical details on this TIM? IF not, does this TIM comply with vacuum (non-operationally) in terms of outgassing standards for vacuum compliance (TNL - WVR < 1% and CVCM < 0.1%)?
NVIDIA does not publicly disclose the internal TIM material used inside the Jetson T5000 module. The module is supplied as an integrated assembly with the TTP, and customers should not remove the TTP. For system integration, customers are responsible for selecting the external TIM between the TTP and their thermal solution and validating the thermal design against the published TTP/SoC temperature limit.
Thank you for the feedback. I understand that you can’t disclose the TIM type that you’re using. Can you then confirm or deny that we can use the Jetson T5000 in a vacuum environment (is the inside TIM vacuum compliant in terms of outgassing standards)?