Hi All,
For thermal interface (heat sink) design for Orin Nano, we refer to the keep out envelope (3D CAD) from April 2023 https://developer.nvidia.com/downloads/jetson-orin-nx-series-jetson-orin-nano-module-3d-cad-step-model
However, is there a more realistic version to the tall components area in RED? On the actual modules, we haven’t quite seen the 4.08mm height being reached in the ‘red’ zone.
Can you clarify if the keep out zone is intended as a future replacement of components to potentially reach said height, or if it can indeed be occupied by the heat sink, especially the thin regions highlighted in green.
