Hello NX Team,
after carefully reading the Thermal Design Guide I’m still missing some information.
Our device will be operated at 60°C ambient temperature. It will be possible to keep the SoC below 86°C with a good attachment to the housing, but the housing temperature might rise to 80°C.
The Thermal Design Guide requires, that the LPDDR4x Memory and some other components shall be kept below 85°C. Whether we can achieve this depends on the power that is produced by these components.
Could you pls. specify an air temperature inside the housing for a safe operation?
Alternatively could you pls. specify the worst-case power and Rth-JA for the Memory Chips? That’s required to desing a cooling solution.
Best regards & many thanks,